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1 publication date: august 2008 sdb00168aeb data sheet AN26027A part no. package code no. alga005-w-0609ana
AN26027A 2 sdb00168aeb contents ? overview ???????????????????.??????????????????????. 3 ? features ???????????????????.??????????????????????. 3 ? applications ???.????????????????????????????????????? 3 ? package ?????????????????????????????????????????. 3 ? type ?????????????...?????????????????????????????. 3 ? application circuit example (block diagram) ???????????.?????????????? 4 ? pin descriptions ???????..??????????????????????????????. 5 ? absolute maximum ratings ????????..?????..???????????????????. 6 ? operating supply volt age range ????..?????? ????????????????????. 6 ? electrical characteristics ???????.???????.???????.????????????. 7 ? electrical characteristics (reference values for design) ???????.???????.??????. 8 ? switching logic table ??????????????????????.???????.??????. 9 ? technical data ??????????????.???????.?????????????????. 10 ? p d ? t a diagram ????........????.???????.???????????????????. 10 ? usage notes ???.?..????? ???.???????.????? ??????????????. 11
AN26027A 3 sdb00168aeb AN26027A single band lna-ic for 600 mhz band applications ? overview AN26027A is single band lna-ic for 600 mhz band applications. it realizes high performance by using 0.18 m sigec bi- cmos process (f t = 90 ghz, f max = 140 ghz). high/low gain-mode is changeable, controlled by integrated cmos logic circuit. a wlcsp package (wafer level chip sized package) achieves miniaturization. ? features y low voltage operation +2.85 v typ. y low current consumption 3 ma typ. (high-gain mode) 1 a typ. (low-gain mode) y high gain (gain) 15.0 db typ. frx = 620 mhz (high-gain mode) y low noise figure (nf) 1.30 db typ. frx = 620 mhz (high-gain mode) y low distortion (iip3 +10 mhz offset) ?4.0 dbm typ. frx = 620 mhz (high-gain mode) y small and thin package (wlcsp) ? applications y 600 mhz band single band lna ? package y 5 pin wafer level chip size package (wlcsp) size: 0.86 0.56 mm 2 (0.3 mm pitch) ? type y bi-cmos ic
AN26027A 4 sdb00168aeb ? application circuit ex ample (block diagram) (top view) 50 rf input 50 rf output a3 a2 a1 b1 l1 c1 v cc c2 cnt (gain cnt) b3 note) 1. this circuit and these circuit constants show an example and do not guarantee the design as a mass-production set. 2. this block diagram is for explaining functions. the part of the block diagram may be omitted, or it may be simplified.
AN26027A 5 sdb00168aeb ? pin descriptions v cc power supply v cc b3 high-gain / low-gain switch input cnt b1 rf output output out a3 gnd ground gnd a2 rf input input in a1 description type pin name pin no.
AN26027A 6 sdb00168aeb ? absolute maximum ratings ? operating supply voltage range *1 v 3.6 v cc supply voltage 1 storage temperature operating ambient temperature power dissipation supply current parameter *3 c ?40 to +125 t stg 5 *3 c ?25 to +75 t opr 4 *2 mw 36 p d 3 ? ma 18 i cc 2 note unit rating symbol a no. 2.5 to 3.0 v cc range ? v supply voltage range note unit symbol parameter note) *1: the range under absolute maximum ratings, power dissipation. *2: power dissipation shows the value of only package at t a = 70 c. when using this ic, refer to the ? p d ?t a diagram in the ? technical data and use under the condition not exceeding the allowable value. *3: expect for the storage temperature and operating ambient temperature, all ratings are for t a = 25 c. note) the values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
AN26027A 7 sdb00168aeb ? a 20 4.6 ? current at cnt pin vih = v cc iih switching current (high) dc-5 ? v 0.4 0.0 ? vil = v cc 0.14 vil switching voltage (low gain mode) dc-4 ? v ? 2.85 2.57 vih = v cc 0.90 vih switching voltage (high gain mode) dc-3 supply current lg dc-2 ? a 10 1.0 ? v cc current at low-gain mode no input signal i cc l dc electrical characteristics ? ma 4.4 3.0 ? v cc current at high-gain mode no input signal i cc h supply current hg dc-1 limits typ unit max no te min conditions symbol parameter b no. ? db ?1.0 ?4.0 ?7.5 low-gain mode prx = ?20 dbm gls power gain lg a-2 ? db 17.0 15.0 13.0 high-gain mode ghs power gain hg a-1 lna ac electrical characteristics ? dbm ? ?4.0 ?12 high-gain mode f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3h1 iip3 +10 mhz offset hg a-3 limits typ unit max no te min conditions symbol parameter b no. note) unless otherwise specified, t a = 25 c 2 c, frxa = 620 mhz, prx = ?30 dbm, cw ? electrical characteristics v cc = 28.5 v note) unless otherwise specified, t a = 25 c 2 c
AN26027A 8 sdb00168aeb ? dbm ? ?4.0 ?13 high-gain mode f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h2 iip3 ?10 mhz offset hg c-6 ? dbm ? ?4.0 ?13 high-gain mode f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) iip3h1 iip3 +10 mhz offset hg c-5 ? db 8.5 6.5 ? low-gain mode f = frx nfl noise figure lg c-4 * db 2.3 1.3 ? high-gain mode f = frx nfh noise figure hg c-3 ? db ?1.0 ?4.0 ?8.0 low-gain mode f = frx, prx = ?20 dbm gl power gain lg c-2 ? db 17.5 15.0 11.5 high-gain mode f = frx gh power gain hg c-1 ? db ? ?3.5 ? high-gain mode f1 = frx isol reverse isolation lg c-9 ? db ? ?24 ? high-gain mode f1 = frx isoh reverse isolation hg c-8 ? dbm ? ?6 ?10 high-gain mode f1 = frx ip1dbh input p1db hg c-7 lna ac electrical characteristics limits typ unit max no te min conditions symbol parameter b no. note) connector & substrate loss (0.1 db) included. ? electrical characteristics (refer ence values for design) v cc = 2.85 v note) unless otherwise specified, t a = 25 c 2 c, frx = 470 mhz, 620 mhz, 770 mhz, prx = ?30 dbm, cw. the characteristics listed below are reference values for design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteristics, matsushita will respond in good faith to user concerns.
AN26027A 9 sdb00168aeb pin voltage high-gain high ? low-gain high-gain / low-gain switching (gain control) b1 remarks low description pin no. ? switching logic table note) see parameters b no. dc-3 to b no. dc-4 in the ? electrical characteristics for control voltage retention ranges.
AN26027A 10 sdb00168aeb ? technical data ? p d ? t a diagram
AN26027A 11 sdb00168aeb ? usage notes 1. this ic is intended to be used for general electronic equipment [cellular phones]. consult our sales staff in advance for information on the following applications: x special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as for automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others: applications of which reliability equivalent to (1) to (7) is required 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it migh t smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the ? pin description for the pin configuration. 4. perform a visual inspection on the pcb before applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perform a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin ? v cc short (power supply fault), output pin ? gnd short (ground fault), or output-to-output-pin short (load short). and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when using the lsi for new models, verify the safety including the long-term reliability for each product. 7. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book. 8. due to unshielded structure of this ic, under exposure of light, function and characteristic of the product cannot be guarante ed. during normal operation or even under testing condition, please ensure that ic is not exposed to light. 9. basically, chip surface is ground potential. please design to ensure no contact between chip surface and metal shielding.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd.

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